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Example of Prototype of Ultrasonic Hot Pressing Gold Wire Ball Welder

Date: 2016-10-22

样机制作 的重要研究成果,它可以自动识别芯片电极、自动焊接、自动送/收物料,大大减轻劳动强度,最大地发挥人员的效能,为半导体制造企业提高生产效率,降低生产成本提供了有利条件。 This fully automatic ultrasonic hot-pressing gold wire ball welding machine is an important research result of Xinxin Technology's special reverse prototype production . It can automatically identify chip electrodes, automatic welding, and automatically send / receive materials, greatly reducing labor intensity and maximizing personnel. The efficiency has provided favorable conditions for semiconductor manufacturing enterprises to improve production efficiency and reduce production costs.

Features:

* Fully automatic operation, one person can operate multiple machines at the same time.

* No air supply required, easy and fast installation.

* Easy to obtain spare parts, simple maintenance and low use cost.

* Full Chinese interface, friendly, easy to learn and easy to master.

* The new stable EFO (negative electron burning ball) design can produce ultra-small and stable gold balls. With the porcelain nozzle designed by our company, it can solder smaller chips.

* The solder joint is stable and reliable, and the consistency is good. Main technical specifications

* Power supply: single-phase 220VAC ± 10%, 50HZ, reliable grounding.

* Power consumption: 400W max

* Applicable wire diameter: φ20 ~ 50μM (0.8 ~ 2mil)

* Welding temperature: 60 ~ 400 ℃

* Welding pressure: 8 ~ 180g (each welding point can be set separately)

* Welding time: 1 ~ 99ms (each welding point can be set independently)

* Ultrasonic power: 0 ~ 3W (each welding point can be set separately)

* Ultrasonic frequency: 63KHz as standard configuration (optional 133 KHz)

* Vision system: PR microscope magnification, standard configuration 3 times (optional 1 to 2.5 times) stereo microscope magnification, 15 times, 30 times two levels.

* Dimensions: 900㎜ (width) × 1000㎜ (depth) × 1300㎜ (height)

* Net weight: 216㎏

Xinxin Technology has long undertaken a full set of cloning and development of various semiconductor manufacturing test equipment, assisting customers in product reference design and application research, providing supporting technical services such as batch product foundry, prototype production, and prototype debugging, and assisting the majority of semiconductor production and manufacturing enterprises to carry out Production line equipment upgrades. Interested parties please contact Xinxin Technology Co., Ltd. for details.

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