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Three-layer core switch PCB design

Date: 2016-10-22

PCB设计 部门详细分析资料计算时序,HSPICE 仿真 1.25G信号与3.125G信号的布线规则。 The three-layer core switch exchange board is a typical high-speed board. The PCB design department of Xinxin Technology analyzes the data in detail to calculate the timing. HSPICE simulates the wiring rules of 1.25G signals and 3.125G signals. Pre-simulation determines the routing topology of RLDRAM, DDRII SDRAM, and TCAM, and post-simulation confirms their timing. The current wiring channel is reasonably designed by the current calculation software. Multi-person parallel design ensures single board progress.

Xinxin Technology's PCB design department uses the BCM56601 chipset solution, with RLDRAM, DDRII SDRAM, and TCAM, with strict timing requirements; 3.125G pairs of high-speed signals on the board, 48 pairs of 1.25G signals, each pair is 13 inches in length; strict impedance control There are many kinds of power sources, there are 8 kinds of currents above 6 amps, a large number of phase-locked loops; the number of single-board PINs is more than 25,000, and a lot of network rules.

In the end, the project was completed, and the design time was reduced by half compared with the time expected by the user. The signal quality met the requirements.

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