Xinxin Technology has a professional high-speed and high-density PCB design and simulation team. It has rich design experience in high-frequency PCB design, high-speed PCB design, PCB simulation, PCB layout, and digital-analog A / D hybrid circuit board design. Customers only need to provide basic schematic diagrams and specifications, from electronic component selection to package production, to PCB board design and board placement, we provide one-stop solutions. Even if you only have product design ideas, and you don't have technical information such as schematic diagrams, we can provide you with overall design solutions for schematic design, structural feature design, device selection, and PCB design to accelerate your product development and promote new products. Get listed quickly and fully grasp market opportunities to win greater economic benefits.
Our technology● Up to 42 layers of high-speed and high-density PCB design capabilities ● Provides high-speed, high-frequency, high-power, analog, digital-analog hybrid, HDI, FPC and other design types Process inspection, EMC inspection ● A senior expert technical team is established to comprehensively check: principle design, DFM, DFT, high speed, EMC, thermal design, etc.
our service● One-stop PCB design, board making, and welding to assist customers in all aspects from principle to product launch. ● Rigorous process and design specifications, in line with the process requirements of mainstream PCB board manufacturers and assembly manufacturers. ● High-speed delivery and on-time delivery.
● Protecting the interests of customers, perfect quality system and after-sales service
- Maximum design layers: 42 layers
- Maximum number of PINs: 100,000+
- Maximum number of connections: 78000+
- Minimum line width: 2.4mil
- Minimum line spacing: 2.4mil
- Minimum via: 6mil (4mil laser hole)
- Maximum number of BGAs: 100+
- Minimum BGA PIN pitch: 0.3mm
- Maximum BGA PIN: 2912
- Highest speed signal: 25Gbps / 28Gbps